We recently kicked off our collaboration with the University of South Florida’s Computer Science department. This collaboration aims to explore the use and integration of thermal cameras with our edge-compute platform and color camera AI capabilities. The challenge this semester for the student group is to use a new FLIR Thermal Sensing chip alongside our color camera sensor to detect a soldering iron on a lab bench and alert if the soldering iron is left on. This problem is challenging because the thermal camera alone might not be able to tell the difference between a soldering iron and another hot object (candle, hot-glue gun, 3D printer extruder, etc). The key will be to implement a proper object detection algorithm from the color camera data and combine the data in a way to make actionable insights.
How could this technology be used for industrial problems? We have many ideas! Contact us if you would like to learn more: Get Started
This is our third semester as a Computing Partner and we’ve really enjoyed working with the students on these projects. If you are interested in partnering with USF for a project like this, check out the Industry Collaboration page of the USF Computer Science department: https://www.usf.edu/engineering/cse/industry/